The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2004

Filed:

Apr. 16, 2002
Applicant:
Inventors:

Takahiro Kitano, Kumamoto, JP;

Shinichi Sugimoto, Kumamoto, JP;

Shinji Kobayashi, Kumamoto, JP;

Naoya Hirakawa, Kumamoto, JP;

Akira Fukutomi, Kumamoto, JP;

Nobukazu Ishizaka, Kumamoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05C 1/102 ; B05C 1/302 ;
U.S. Cl.
CPC ...
B05C 1/102 ; B05C 1/302 ;
Abstract

The present invention relates to a processing unit for processing a substrate, which comprises a chamber for housing the substrate and forming a hermetically closeable processing room, and an exhauster for exhausting an atmosphere in the processing room from an upper portion of the chamber to reduce a pressure in the processing room. The processing unit of the present invention includes a current plate for controlling an atmospheric current formed in the processing room when the pressure is reduced, and the chamber has a mounting table for mounting the substrate thereon, an almost cylindrical lid body with its lower face open for covering the substrate on the mounting plate from above and forming the processing room integrally with the mounting table, and a supporting member for supporting the current plate so that the current plate is parallel to the mounting plate. According to the present invention, the speed of an atmospheric current flowing between the current plate and the substrate becomes uniform within the surface of the substrate, and consequently when a coating film on the substrate is dried, the film is planarized to have a uniform thickness.


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