The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 2004

Filed:

Nov. 13, 2000
Applicant:
Inventors:

Helmut Aschner, Beimerstetten, DE;

Patrick Schmid, Dornstadt, DE;

Dieter Zernickel, Ulm, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F27D 5/00 ;
U.S. Cl.
CPC ...
F27D 5/00 ;
Abstract

The invention relates to a device and a method for the heat treatment of substrates, especially semiconductor wafers. The device comprises a reaction chamber with a compensation element. According to the invention the substrate can be inserted and withdrawn again more easily by the fact that the compensation element ( ) can be at least partly lowered and/or raised in the reaction chamber.


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