The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2004
Filed:
Apr. 08, 2003
Thiam Chye Lim, Singapore, SG;
Kay Kit Tan, Singapore, SG;
Kian Chai Lee, Singapore, SG;
Victor Cher Khng Tan, Singapore, SG;
Kwang Hong Tan, Singapore, SG;
Chong Pei Andrew Lim, Singapore, SG;
Yong Kian Tan, Singapore, SG;
Teck Kheng Lee, Singapore, SG;
Sian Yong Khoo, Singapore, SG;
Yoke Kuin Tang, Singapore, SG;
Micron Technology, Inc., Boise, ID (US);
Abstract
Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.