The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2004
Filed:
Jun. 28, 2002
Applicant:
Inventors:
Jiong-Ping Lu, Dallas, TX (US);
Wei-Yung Hsu, Dallas, TX (US);
Qi-Zhong Hong, Dallas, TX (US);
Richard A. Faust, Austin, TX (US);
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
A copper interconnect having a transition metal-nitride barrier ( ) with a thin metal-silicon-nitride cap ( ). A transition metal-nitride barrier ( ) is formed over the structure. Then the barrier ( ) is annealed in a Si-containing ambient to form a silicon-rich capping layer ( ) at the surface of the barrier ( ). The copper ( ) is then deposited over the silicon-rich capping layer ( ) with good adhesion.