The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2004
Filed:
Mar. 04, 2002
Applicant:
Inventors:
Seiichiro Kanno, Chiyoda, JP;
Hironobu Kawahara, Kudamatsu, JP;
Mitsuru Suehiro, Kudamatsu, JP;
Saburou Kanai, Hikari, JP;
Toshio Masuda, Toride, JP;
Assignee:
Hitachi High-Technologies Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/166 ;
U.S. Cl.
CPC ...
H01L 2/166 ;
Abstract
A wafer processing apparatus comprising a wafer stage, wherein a semiconductor wafer is mounted on the wafer stage so as to process the semiconductor wafer, wherein a holding mechanism of the wafer stage is commonly used for a plurality of wafer stages, and accordingly, the wafer stage can be changed into a wafer stage having a different function so as to process the semiconductor wafer.
Quick Actions:
Kanno, Seiichiro. (2004). Wafer processing apparatus and a wafer stage and a wafer processing method (U.S. Patent No. 6677167). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6677167
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile