The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6653233 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 25, 2003

Filed:

Jun. 27, 2001
Applicant:
Inventors:

John Michael Cotte, New Fairfield, CT (US);

Kenneth John McCullough, Fishkill, NY (US);

Wayne Martin Moreau, Wappinger, NY (US);

Keith R. Pope, Danbury, CT (US);

John P. Simons, Wappingers Falls, NY (US);

Charles J. Taft, Wappingers Falls, NY (US);

Richard P. Volant, New Fairfield, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/14763 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/14763 ;
Abstract

A process of providing a semiconductor device with electrical interconnection capability wherein a sacrificial material is introduced into topographical features of the semiconductor device prior to chemical mechanical polishing so that debris formed during chemical mechanical polishing is incapable of falling into topographical features present on the semiconductor device. The sacrificial material is thereupon removed by liquid or supercritical carbon dioxide.


Find Patent Forward Citations

Cotte, John. (2003). Process of providing a semiconductor device with electrical interconnection capability (U.S. Patent No. 6653233). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6653233

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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