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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6645824 B1

PDFFull Text
Date of Patent:
Nov. 11, 2003

Filed:

Apr. 30, 2002

Combined optical profilometry and projection microscopy of integrated circuit structures

Applicant:
Inventors:

Wenge Yang, Fremont, CA (US);

Junwei Bao, Fremont, CA (US);

Xinhui Niu, Los Altos, CA (US);

Nickhil Jakatdar, Los Altos, CA (US);

Yasuhiro Okumoto, Ibaraki, JP;

Assignee:

Timbre Technologies, Inc., Santa Clara, CA (US);

Attorney:

Morrison & Foerster LLP

Primary Examiner:

David Nelms

Assistant Examiner:

Mai-Huong Tran

Int. Cl.
CPC ...
H01L 2/176 ;
U.S. Cl.
CPC ...
H01L 2/176 ;
Abstract

A metrology method and system of structures on a wafer includes obtaining a projection image of at least a first portion of the structures on the wafer using a first metrology apparatus. A profile of at least a second portion of the structure on the wafer is obtained using a second metrology apparatus. The information from the profile obtained using the second metrology apparatus and the information from the projection image obtained using the first metrology apparatus are combined using a processor.

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Yang, Wenge. (2003). Combined optical profilometry and projection microscopy of integrated circuit structures (U.S. Patent No. 6645824). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6645824

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