The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2003
Filed:
Dec. 22, 2000
Junji Kunisawa, Kanagawa-ken, JP;
Mitsuko Odagaki, Kanagawa-ken, JP;
Natsuki Makino, Kanagawa-ken, JP;
Koji Mishima, Kanagawa-ken, JP;
Kenji Nakamura, Kanagawa-ken, JP;
Hiroaki Inoue, Tokyo, JP;
Norio Kimura, Kanagawa-ken, JP;
Tetsuo Matsuda, Gunma-ken, JP;
Hisashi Kaneko, Kanagawa-ken, JP;
Nobuo Hayasaka, Kanagawa-ken, JP;
Katsuya Okumura, Kanagawa-ken, JP;
Manabu Tsujimura, Kanagawa-ken, JP;
Toshiyuki Morita, Kanagawa-ken, JP;
Other;
Abstract
A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion horizontally holding and rotating a substrate with its surface to be plated facing upward. A seal material contacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrode passes an electric current upon contact with the substrate. A cathode portion rotates integrally with the substrate holding portion . An electrode arm portion is above the cathode portion and movable horizontally and vertically and has an anode face-down. Plating liquid is poured into a space between the surface to be plated and the anode brought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.