The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2003
Filed:
Jul. 23, 2001
Applicant:
Inventors:
Wenling Wang, Shiroyama-Machi, JP;
Koichi Sakamoto, Shiroyama-Machi, JP;
Fujio Suzuki, Shiroyama-Machi, JP;
Takashi Yokota, Shiroyama-Machi, JP;
Assignee:
Tokyo Electron Limited, Tokyo-To, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/900 ;
U.S. Cl.
CPC ...
G06F 1/900 ;
Abstract
A heat treatment apparatus has a controller ( ) provided with a temperature estimator ( ) for estimating a temperature of a wafer by detection signals of temperature sensors (Sin, Sout) and a temperature calibrator ( ) for correcting the estimated temperature of the wafer. In order to calibrate the temperature, an offset value stored in an offset table ( ) is used. The offset value is determined based on the relationship between film-thickness of films formed in an experimental heat treatment process and process temperatures.