The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2003

Filed:

Aug. 27, 1999
Applicant:
Inventors:

Lanhua Wei, Fremont, CA (US);

Jon Opsal, Livermore, CA (US);

Allan Rosencwaig, Danville, CA (US);

Assignee:

Therma-Wave, Inc., Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 1/128 ; G01N 2/186 ;
U.S. Cl.
CPC ...
G01B 1/128 ; G01N 2/186 ;
Abstract

A composite metrology tool, measures basic optical parameters of thin films (e.g., thickness, index of refraction, and birefringence) and stress (e.g., wafer displacements, such as bow and warp). These measurements are combined (e.g. in a processor) using optimization techniques to yield accurate overall information of the wafer parameters.


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Wei, Lanhua. (2003). Combination thin-film stress and thickness measurement device (U.S. Patent No. 6608689). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6608689

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