The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2003

Filed:

May. 23, 2002
Applicant:
Inventors:

Tsu Shih, Hsin-Chu, TW;

Sung-Ming Jang, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/176 ;
U.S. Cl.
CPC ...
H01L 2/176 ;
Abstract

A method for avoiding a step height over an alignment mark area including providing at least one alignment mark area disposed at a semiconductor wafer process surface periphery said alignment mark area having alignment marks anisotropically etched into the semiconductor wafer process surface; depositing a first insulating dielectric layer over an active area of the semiconductor wafer process surface to include covering the at least one alignment mark area; planarizing the first insulating dielectric layer; depositing a polysilicon layer over the active area of the semiconductor wafer process surface to include covering the at least one alignment mark area; and, anisotropically etching the polysilicon layer through a thickness over the at least one alignment mark area to form an opening extending no further than about the first insulating dielectric layer to minimize a step height.


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