The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2003

Filed:

Dec. 21, 2001
Applicant:
Inventors:

Damion T. Searls, Portland, OR (US);

Terrance J. Dishongh, Hillsboro, OR (US);

James D. Jackson, Beaverton, OR (US);

Thomas O. Morgan, Hillsboro, OR (US);

Roth O. Weston, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract

A method and apparatus to thermally control multiple electronic components, such as field-effect transistors for voltage regulation in processors and chipsets in computers, allow more effective convective cooling by grouping the electronic components in an at least essentially closed loop configuration about a passageway which is open at both ends to permit air flow therethrough. The electronic components form respective side walls of the passageway or are in heat conducting relation with the side walls of a heat sink which forms the passageway. Mounting the electronic components to stand upright off the motherboard allows air to enter below the components and rise up through the passageway producing an increase in air speed and better convective cooling.


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