The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2003
Filed:
Nov. 17, 2000
Leena P. Buchwalter, Hopewell Junction, NY (US);
Alessandro Cesare Callegari, Yorktown Heights, NY (US);
Stephan Alan Cohen, Wappingers Falls, NY (US);
Teresita Ordonez Graham, Irvington, NY (US);
John P. Hummel, Millbrook, NY (US);
Christopher V. Jahnes, Upper Saddle River, NJ (US);
Sampath Purushothaman, Yorktown Heights, NY (US);
Katherine Lynn Saenger, Ossining, NY (US);
Jane Margaret Shaw, Stoney Creek, CT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention includes a multilevel air-gap-containing interconnect wiring structure including: a collection of interspersed line levels and via levels, the via levels and line levels containing conductive via and line features embedded in a dielectric having an air-gap and solid dielectric. The air-gap and solid dielectric includes (i) one or more solid dielectrics only in the shadows of the conductive features in overlying levels and (ii) a gaseous dielectric elsewhere in the structure. The collection of line levels and via levels are topped by a laminated thin, taut insulating cover layer having openings to selected conductive features in the topmost underlying line or via layer, and the openings are filled with conductive material connecting to terminal pad contacts on the insulating cover layer.