The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2003
Filed:
Aug. 10, 2001
Michael Weber-Grabau, Sunnyvale, CA (US);
Ivelin A. Anguelov, Sunnyvale, CA (US);
Edric H. Tong, Sunnyvale, CA (US);
Adam E. Norton, Palo Alto, CA (US);
Fred E. Stanke, Cupertino, CA (US);
Badru D. Hyatt, San Jose, CA (US);
Sensys Instruments Corporation, Santa Clara, CA (US);
Abstract
A wafer measurement apparatus ( ) and method for measuring a film thickness property of a wafer ( ) that does not require a water bath or complicated wafer handling apparatus. The apparatus includes a chuck ( ) having an upper surface ( ) for supporting the wafer, and a perimeter ( ). Also included is a metrology module ( ) for measuring one or more film thickness properties. The metrology module is arranged adjacent the chuck upper surface and has a measurement window ( ) with a lower surface ( ) arranged substantially parallel to the chuck upper surface, thereby defining an open volume ( ). The apparatus includes a water supply system in fluid communication with the open volume via nozzles ( ) for flowing water through and back-filling the volume in a manner that does not produce bubbles within the volume. A catchment ( ) surrounding the chuck may be used to catch water flowing out of the volume. Methods of performing measurements of one or more wafer film properties are also described.