The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2003

Filed:

May. 30, 2001
Applicant:
Inventors:

Masanori Tateyama, Kikuchi-Gun, JP;

Syuzo Fujimaru, Kikuchi-Gun, JP;

Assignee:

Tokyo Electron Limited, Tokyo-To, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 7/00 ;
U.S. Cl.
CPC ...
G06F 7/00 ;
Abstract

The present invention is a substrate processing method comprising the steps of successively extracting unprocessed wafers from a cassette, successively conveying the extracted wafers to a plurality of processing units, causing the processing units to process the wafers in parallel, and returning the processed wafers to a cassette. A process completion prediction time at which processes for one lot are completed is calculated and displayed corresponding to a process recipe that has been set to a plurality of wafers for at least one lot. Corresponding to the process completion prediction time, a cassette that contains a plurality of unprocessed wafers for one lot is accepted. A cassette that contains a plurality of processed wafers for one lot is returned.


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