The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2003

Filed:

Sep. 14, 1999
Applicant:
Inventors:

Masahiko Matsumoto, Kanagawa-ken, JP;

Hisato Oyamatsu, Kanagawa-ken, JP;

Takeo Nakayama, Kanagawa-ken, JP;

Yasuhiro Fukaura, Kanagawa-ken, JP;

Kunihiro Kasai, Kanagawa-ken, JP;

Masahiro Inohara, Tokyo, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/358 ;
U.S. Cl.
CPC ...
H01L 2/358 ;

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Matsumoto, Masahiko. (2003). Semiconductor wafer, method of manufacturing the same and semiconductor device (U.S. Patent No. 6525402). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6525402

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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