The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2003

Filed:

Jan. 19, 2000
Applicant:
Inventors:

Akihisa Hongo, Tokyo, JP;

Kenichi Suzuki, Tokyo, JP;

Atsushi Chono, Tokyo, JP;

Mitsuo Tada, Tokyo, JP;

Akira Ogata, Tokyo, JP;

Satoshi Sendai, Tokyo, JP;

Koji Mishima, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23H 3/02 ; B23H 7/04 ; B23H 7/14 ; C25B 1/500 ; C25B 9/00 ;
U.S. Cl.
CPC ...
B23H 3/02 ; B23H 7/04 ; B23H 7/14 ; C25B 1/500 ; C25B 9/00 ;
Abstract

The present invention is to provide a conduction detection device that can detect electrical conductivity (contact condition) of feeding contacts with conductive layers of a substrate. The present invention also provides an electroplating apparatus, which is able to produce uniform currents to flow through each of feeding contacts. The apparatus has a plating vessel, in which an electrode is disposed opposite to a substrate which is affixed to a plating jig electrically through a plurality of feeding contacts for applying a specific voltage between the electrode and conductive layers provided on a plating surface of the substrate. Plating current flows from the plating jig through the feeding contacts to the substrate. A conduction detection device is provided to detect electrical conductive states between the plurality of feeding contacts and the conductive layer on the substrate.


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