The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2002
Filed:
Feb. 28, 2001
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A BGA (Ball Grid Array) package is proposed, which is characterized by the provision of an interdigitated power/ground ring layout scheme. By this layout scheme, the power ring and the ground ring are each formed with a line portion and a plurality of toothed portions; with the toothed portions of the power ring being are interdigitated with the toothed portions of the ground ring. Moreover, the power/ground vias are all connected to the toothed portions of the power ring and the ground ring, thereby leaving the line portions of the power ring and the ground ring unoccupied by the power/ground vias, allowing the routability of power/ground wires to be higher than the prior art. Moreover, solder bask is formed in such a manner as to cover all the toothed portions of the ground ring, so that power wires can be prevented from being short-circuited to the ground ring due to sagging. Further, the toothed portions of the power ring and the ground ring are large in area, whereby two or more power vias or ground vias can be gathered together to increase the overall electrical performance, and whereby the packaged chip can be increased in heat-dissipation efficiency.