The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2002
Filed:
Jul. 09, 2001
Nobuyuki Hayama, Tokyo, JP;
Masaaki Kuzuhara, Tokyo, JP;
Kouji Matsunaga, Tokyo, JP;
Tatsuo Nakayama, Tokyo, JP;
Yuji Takahashi, Tokyo, JP;
Yasuo Ohno, Tokyo, JP;
Kazuaki Kunihiro, Tokyo, JP;
Kensuke Kasahara, Tokyo, JP;
Hironobu Miyamoto, Tokyo, JP;
Yuji Ando, Tokyo, JP;
NEC Corporation, , JP;
Abstract
In a method of manufacturing a semiconductor device, trench sections are formed on a side of one of opposing surface portions of a substrate. At lest a part of each of the trench sections is covered by a power supply metal layer which is formed on the one surface portion of the substrate. The substrate is fixed to a support such that the one surface of the substrate fits to the support. A chip is separated from the substrate using the trench sections. A conductive film is formed on side surface portions of the chip and the other surface portion of the chip. Then, the chip is separated from the support.