The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2002
Filed:
Oct. 28, 1999
David Gerald Coult, Bechtelsville, PA (US);
Duane Donald Wendling, Kutztown, PA (US);
Charles William Lentz, Lower Heidleburg Township, PA (US);
Bryan Phillip Segner, Upper Macungie, PA (US);
Gustav Edward Derkits, New Providence, NJ (US);
Wan-ning Wu, Springfield, VA (US);
Franklin Roy Dietz, Mohnton, PA (US);
Agere Systems Guardian Corp., Berkeley Heights, NJ (US);
Abstract
A system for measuring the thickness of a wafer while it is being thinned this disclosed. The system and method provide integrating an optical reflectometer into a common wafer thinning apparatus. Using reflected optical signals from the top and bottom of the wafer, the thickness of the wafer is determined with time based calculations in real-time while thinning is occurring. Once the desired thickness has been reached, the thinning operation is halted. By performing the measurement in-situ, this system and a method prevent scrapping of wafers which are overthinned and the reloading of wafers which are too thick. Since an optical reflectometer is used, the measurement is contactless, and thus prevents possible damage to wafers during measurement.