Lower Heidleburg Township, PA, United States of America

Charles William Lentz


Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: The Innovations of Charles William Lentz

Introduction

Charles William Lentz is an accomplished inventor based in Lower Heidelberg Township, PA. He is known for his significant contributions to the field of wafer thinning technology. With a focus on enhancing measurement techniques, Lentz has developed innovative solutions that improve efficiency and accuracy in semiconductor manufacturing.

Latest Patents

Lentz holds a patent for an invention titled "In-situ automated contactless thickness measurement for wafer thinning." This system is designed to measure the thickness of a wafer while it is being thinned. By integrating an optical reflectometer into a common wafer thinning apparatus, the system utilizes reflected optical signals from both the top and bottom of the wafer. This allows for real-time thickness determination through time-based calculations during the thinning process. Once the desired thickness is achieved, the thinning operation is halted. This in-situ measurement approach prevents the scrapping of overthinned wafers and eliminates the need to reload wafers that are too thick. The contactless nature of the optical reflectometer also ensures that wafers are not damaged during measurement.

Career Highlights

Lentz has made significant strides in his career, particularly through his work at Agere Systems Guardian Corporation. His innovative approach to wafer thinning has positioned him as a key figure in the semiconductor industry. With a single patent to his name, Lentz continues to push the boundaries of technology in his field.

Collaborations

Throughout his career, Lentz has collaborated with notable colleagues, including David Gerald Coult and Duane Donald Wendling. These partnerships have contributed to the advancement of technology in wafer processing and measurement techniques.

Conclusion

Charles William Lentz is a pioneering inventor whose work in wafer thinning technology has made a lasting impact on the semiconductor industry. His innovative patent demonstrates a commitment to improving manufacturing processes and ensuring the quality of semiconductor products.

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