Company Filing History:
Years Active: 2001-2002
Title: Duane Donald Wendling: Innovator in Optical Measurement Technologies
Introduction
Duane Donald Wendling is a notable inventor based in Kutztown, PA (US). He has made significant contributions to the field of optical measurement technologies, holding a total of 2 patents. His innovative work focuses on improving the efficiency and accuracy of wafer thinning processes.
Latest Patents
Wendling's latest patents include a system for in-situ automated contactless thickness measurement for wafer thinning. This system integrates an optical reflectometer into a common wafer thinning apparatus. It allows for real-time thickness measurement during the thinning process, preventing the scrapping of overthinned wafers and the reloading of those that are too thick. The contactless nature of the measurement ensures that wafers are not damaged during the process.
Another significant patent is for a fixture with at least one trough and a method of using the fixture in a plasma or ion beam. This invention allows for the cleaning of optical components by exposing them to a plasma or ion beam while shielding sensitive surfaces. This process effectively removes contaminants that can form during fabrication, ensuring that optical components can be reliably mounted onto substrates.
Career Highlights
Throughout his career, Wendling has worked with several prominent companies, including Agere Systems, Guardian Corporation, and Lucent Technologies Inc. His experience in these organizations has contributed to his expertise in optical technologies and innovations.
Collaborations
Wendling has collaborated with notable individuals in his field, including David Gerald Coult and Gustav Edward Derkits, Jr. These collaborations have further enriched his work and contributions to optical measurement technologies.
Conclusion
Duane Donald Wendling's innovative patents and career achievements highlight his significant impact on the field of optical measurement technologies. His work continues to influence advancements in wafer thinning processes and optical component fabrication.