The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2002

Filed:

Jul. 09, 1999
Applicant:
Inventors:

Richard Hong, San Jose, CA (US);

James H. Tsung, San Jose, CA (US);

Gunnar Vatvedt, Los Gatos, CA (US);

Peijun Ding, San Jose, CA (US);

Arvind Sundarrajan, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/38 ;
U.S. Cl.
CPC ...
H05B 3/38 ;
Abstract

The present invention generally provides a substrate processing system having a thermally conductive and electrically insulative member coupled to a heated member that provides for heat dissipation from the heated member. In a preferred embodiment, the present invention provides for heat dissipation through thermal conductance of an electrically insulated coil in an IMP reaction chamber.


Find Patent Forward Citations

Hong, Richard. (2002). Enhanced cooling imp coil support (U.S. Patent No. 6376807). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6376807

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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