The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2002
Filed:
Mar. 17, 2000
Applicant:
Inventors:
Walter Glashauser, Oberhaching, DE;
Lutz Teichgräber, Grimma, DE;
David Haggart, Dresden, DE;
Katrin Ebner, Dresden, DE;
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 ; B23B 3/128 ;
U.S. Cl.
CPC ...
B24B 1/00 ; B23B 3/128 ;
Abstract
A polishing head ( ) for a chemical-mechanical polishing machine that holds a semiconductor wafer ( ) against a polishing pad ( ) has a chuck ( ) with a pressure chamber ( ) to apply a down force substantially equally to the wafer backside ( ). An electrode arrangement ( ) within the chamber ( ) is located coplanar to the wafer ( ) to provide compensation to wafer or chuck irregularities by applying a compensation force having a distribution corresponding to the irregularities.