The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2002
Filed:
Jul. 11, 2000
Junichiro Yoshioka, Tokyo, JP;
Kenya Tomioka, Tokyo, JP;
Satoshi Sendai, Tokyo, JP;
Atsushi Chono, Tokyo, JP;
Naomitsu Ozawa, Kanagawa, JP;
Ebara Corporation, Tokyo, JP;
Abstract
The present invention is to provide a wafer plating jig for a plating apparatus having a simple construction and capable of sealing conducting pins from the plating solution completely. The wafer plating jig for gripping a wafer, comprises a main jig body ( ) having a plurality of gripping mechanisms ( ) and a plurality of conducting pins disposed thereon. A seal packing ( ) is provided to surround each of the conducting pins. When the wafer is gripped by the gripping mechanisms ( ), each end of the conducting pins individually contacts conductive film formed on the wafer and being sealed by the seal packing ( ).