The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2002
Filed:
Jun. 28, 2000
Kevin S. Petrarca, Newburgh, NY (US);
John E. Heidenreich, III, Yorktown Heights, NY (US);
Judith M. Rubino, Ossining, NY (US);
Carlos J. Sambucetti, Croton on Hudson, NY (US);
Richard P. Volant, New Fairfield, CT (US);
George F. Walker, New York, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of manufacturing integrated circuits wherein a conductive structure in a topmost semiconductive layer of an integrated circuit is provided having a thickness greater than or equal to 1.5 &mgr;m. The thickness of the conductive structure is sufficiently great as to effectively protect any layers beneath the topmost semiconductive layer from damage from pressure, such as pressure applied by testing probes. In a preferred embodiment, traditional aluminum TD leveling is discarded in favor of gold deposited upon the thickened conductive layer.