The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2001

Filed:

Jul. 18, 1997
Applicant:
Inventors:

Cyril Cabral, Jr., Ossining, NY (US);

Patrick William DeHaven, Poughkeepsie, NY (US);

Daniel Charles Edelstein, New Rochelle, NY (US);

David Peter Klaus, Yorktown Heights, NY (US);

James Manley Pollard, III, Bethel, CT (US);

Carol L. Stanis, Portland, ME (US);

Cyprian Emeka Uzoh, Hopewell Junction, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract

An interconnect structure and barrier layer for electrical interconnections is described incorporating a layer of TaN in the hexagonal phase between a first material such as Cu and a second material such as Al, W, and PbSn. A multilayer of TaN in the hexagonal phase and Ta in the alpha phase is also described as a barrier layer. The invention overcomes the problem of Cu diffusion into materials desired to be isolated during temperature anneal at 500° C.


Find Patent Forward Citations

Cabral, Jr., Cyril. (2001). Thin metal barrier for electrical interconnections (U.S. Patent No. 6291885). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6291885

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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