The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2001

Filed:

Dec. 16, 1998
Applicant:
Inventors:

Sun-Chieh Chien, Hsinchu, TW;

Chien-Li Kuo, Hsinchu Hsien, TW;

Tzung-Han Lee, Taipei, TW;

Wei-Wu Liao, Taipei Hsien, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/14163 ;
U.S. Cl.
CPC ...
H01L 2/14163 ;
Abstract

A method of enhancing chemical mechanical polishing uniformity is provided. In the fabrication of a shallow trench isolation structure, there are active area regions with different integration formed in a chip. The integration of the active area regions in the chip is computed according circuit designs by a program analysis. One of the active area regions with the highest integration is used as a basis, dummy mesas are formed in the other active area regions to adjust the integration of the chip.


Find Patent Forward Citations

Chien, Sun-Chieh. (2001). Method to improve the uniformity of chemical mechanical polishing (U.S. Patent No. 6284647). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6284647

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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