The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2001
Filed:
Apr. 22, 1997
Hans-Hermann Oppermann, Berlin, DE;
Elke Zakel, Falkensee, DE;
Ghassem Azdasht, Berlin, DE;
Paul Kasulke, Berlin, DE;
PAC Tech-Packaging Technologies GmbH, Nauen, DE;
Abstract
Process for the formation of a spatial chip arrangement having several chips (,) arranged in several planes and electrically connected to one another, in which the chips are connected via their peripheral connection surfaces (,) to assigned conducting paths (,) of a conducting-path structure (,) arranged on at least one carrier substrate (,) by the chips being arranged either transverse to the longitudinal extent of the carrier substrate or parallel to the longitudinal extent of the flexibly constructed carrier substrate, as well as a spatial chip arrangement that is formed by means of this process.