The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2001
Filed:
Jan. 04, 1999
Wen-Ten Chen, Chung-ho, TW;
Chung-Yang Lin, Hsing-chu, TW;
Fang-Lin Lu, Chung-ho, TW;
Kau-Po Yeh, Hsin-chu, TW;
Taiwan Semiconductor Manufactoring Company, Ltd., Hsin Chu, TW;
Abstract
A method for off-line testing a polishing head used in a CMP polishing apparatus is disclosed. The method utilizes at least two sets of pressurizing/vacuuming/venting devices for the independent testing of at least two fluid chambers which may include a membrane chamber, a retaining ring chamber and an innertube chamber normally found in a CMP polishing head. The present invention further discloses an off-line testing apparatus for a chemical mechanical polishing head which includes at least two independent sets of pressurizing/vacuuming/venting devices for testing a CMP head that is equipped with at least two fluid chambers such as a membrane chamber, a retaining ring chamber and an innertube chamber. The method and apparatus can be used advantageously for testing a variety of defects in a CMP polishing head prior to the installation of the head into a CMP apparatus. The defects include leakage between the fluid chambers, loss of vacuum seal in the fluid chambers, and binding between the fluid chambers. A pressurizing source utilized may be a general nitrogen gas in a fabrication plant. The vacuum source may be factory vacuum.