The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2001
Filed:
Apr. 04, 2000
Applicant:
Inventors:
Cheng-Tzung Tsai, Taipei, TW;
Cheng-Chih Kung, Miaoli, TW;
Lien-Sheng Chung, Hsinchu, TW;
Tai-Yuan Li, Taipei, TW;
Assignee:
United Microelectronics Corp., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 7/04 ;
U.S. Cl.
CPC ...
B08B 7/04 ;
Abstract
A method is disclosed for removing pad nodules. The method provides a wafer comprising pads and pad nodules which are formed on said pads, wherein said pads are made from a metal selected from the group consisting of aluminum and an aluminum-copper alloy. Then, the method dips the wafer into deionized water for removing the pad nodules. Thereafter, the method spin-dries the wafer and coats an alkaloid developer on the wafer for further removing the pad nodules. Finally, the method removes the alkaloid developer from the wafer and bakes the wafer.