The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2001

Filed:

Dec. 17, 1999
Applicant:
Inventors:

Syun-Ming Jang, Hsin-Chu, TW;

Chung-Long Chang, Yun-Lin County, TW;

Shwangming Jeng, Hsin-Chu, TW;

Chen-Hua Yu, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1311 ;
U.S. Cl.
CPC ...
H01L 2/1311 ;
Abstract

A method for forming a microelectronic layer within a microelectronic fabrication first employs a substrate. There is then formed over the substrate a target microelectronic layer. There is then formed upon the target microelectronic layer a sacrificial smoothing layer. Finally, there is then etched the sacrificial smoothing layer completely from the target microelectronic layer while partially etching the target microelectronic layer to form a partially etched target microelectronic layer with an enhanced surface smoothness in comparison with the target microelectronic layer.


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