The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2001
Filed:
Dec. 14, 1999
Intel Corporation, Santa Clara, CA (US);
Abstract
An enhanced heat dissipation device for a chip-on-flex packaged unit includes a flex circuit material attached to a front side of an integrated circuit die. The flex circuit material further attached to a bottom side of a printed circuit board having an opening to expose the flex circuit material. A top heat spreader thermally coupled to the flex circuit material through the opening in the printed circuit to dissipate heat from the front side of the integrated circuit die. The device further includes a bottom heat spreader, that is thermally coupled to back side of the integrated circuit die, to dissipate heat from the back side of the integrated circuit die. This enables the heat dissipation device to dissipate heat from both the front side and back side of the integrated circuit die, and thereby enhancing the heat dissipation for a given unit surface are of the integrated circuit die without increasing the volume of the heat dissipation device.