The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2001

Filed:

Jun. 29, 1999
Applicant:
Inventors:

Yu-Chia Chang, Hsin-Chu, TW;

Jain-Li Wu, Hsin-Chu, TW;

Chung-I Cheng, Hsin-Chu, TW;

Chih-Chiang Yang, Hsin-Chu, TW;

Pei Wei Yeh, Tainan, TW;

Yung-Tai Tseng, Hsin-Chu, TW;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 1/00 ;
U.S. Cl.
CPC ...
B24B 1/00 ;
Abstract

The present invention discloses a method for preventing particle contamination in a polishing machine that utilizes slurry composition for the removal of material from the surface of a substrate. The novel method is particularly suited for use in a chemical mechanical polishing apparatus in which a slurry composition is used. The method includes the step of providing a plurality of cleaning devices each having a bendable, shapable conduit and a spray nozzle for dispensing a cleaning solvent on the spindle and the conditioner arm utilized in the CMP apparatus. The present invention further discloses an apparatus for use in carrying out a method for preventing particle contamination in a CMP apparatus by using bendable, shapable conduits for dispensing a cleaning solvent such as deionized water onto the chamber components for removing slurry deposits that may have splattered thereon and therefore, eliminating sources for particle contamination.


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