The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2001
Filed:
Apr. 01, 1998
Applicant:
Inventors:
Minoru Numoto, Mitaka, JP;
Takao Inaba, Mitaka, JP;
Kenji Sakai, Mitaka, JP;
Hisashi Terashita, Mitaka, JP;
Manabu Satoh, Mitaka, JP;
Assignee:
Tokyo Seimitsu Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 7/22 ;
U.S. Cl.
CPC ...
B24B 7/22 ;
Abstract
The polishing apparatus comprises a turn table, which polishes a semiconductor wafer, and a holding and pressing part, which holds and presses the semiconductor wafer against a polishing surface of the turn table. The holding and pressing part transmits a force from an air bag to the semiconductor wafer via a pressurized fluid layer to thereby press the semiconductor wafer against the polishing surface via the pressurized fluid layer, so that the semiconductor wafer can be polished. Thereby, it is possible to uniformly polish the semiconductor wafer.