The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2000
Filed:
Dec. 14, 1998
Shamouil Shamouilian, San Jose, CA (US);
Ananda Kumar, Milpitas, CA (US);
Arnold Kholodenko, San Francisco, CA (US);
Dennis S Grimard, Ann Arbor, MI (US);
Liang Guo Wang, San Jose, CA (US);
Gerhard Schneider, Cupertino, CA (US);
Michael G Chafin, San Jose, CA (US);
Semyon Kats, San Francisco, CA (US);
Alexander Veytser, Mountainview, CA (US);
Senh Thach, Union City, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A semiconductor wafer chuck for retaining a semiconductor wafer during semiconductor wafer processing in a semiconductor wafer processing system including a connector connecting DC chucking voltage and RF biasing power to an electrode embedded in the body of the chuck. The connector for the chuck includes two or more members joined by resilient banana connections. The connector may be adapted for use as a high temperature connector for an electrostatic chuck operated at an elevated temperature and such connector includes a thermal impedance for reducing the heat transferred from the chuck to the bottom of the connector.