The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2000
Filed:
Apr. 08, 1998
William Brearley, Poughkeepsie, NY (US);
Laertis Economikos, Wappingers Falls, NY (US);
Paul F Findeis, Glenham, NY (US);
Kimberley A Kelly, Poughkeepsie, NY (US);
Bouwe W Leenstra, Walden, NY (US);
Arthur Gilman Merryman, Hopewell Junction, NY (US);
Eric Daniel Perfecto, Poughkeepsie, NY (US);
Chandrika Prasad, Wappingers Falls, NY (US);
James Patrick Wood, Beacon, NY (US);
Roy Yu, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An apparatus for use in manufacturing a semiconductor device includes an input-output (IO) face having a plurality of IO lands, and is situated in an operating position in abutting relation with a depositor. The apparatus includes a first holding member holding the depositor in a first position; a second holding member holding the semiconductor device in the operating position. The depositor and the semiconductor device cooperate in the operating position to deposit solder ball connection structures to the IO lands. The apparatus further includes a separating member for moving at least one of the depositor and the semiconductor device from the operating position to an interim orientation. The interim orientation establishes a separation distance intermediate the depositor and the semiconductor device appropriate to disengage the solder ball connecting structures from the depositor.