The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2000

Filed:

Jul. 24, 1995
Applicant:
Inventors:

Yasuhiro Horiike, Nerima-ku, JP;

Takayuki Fukasawa, Yamanashi, JP;

Assignees:

Tokyo Electron Limited, Tokyo-To, JP;

Tokyo Electron Yamanashi Limited, Yamanashi-Ken, JP;

Yasuhiro Horiike, Tokyo-To, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
20419217 ; 20419215 ; 20419222 ; 20419223 ; 20429806 ; 20429816 ; 20429819 ;
Abstract

A target and a wafer are opposed to each other in a processing vessel in the form of a quartz tube whose internal pressure can be reduced. A low bias voltage is applied to the wafer while Helicon wave plasma of high density is generated between the target and the wafer by an antenna disposed on the circumference of the processing vessel. The wafer is positioned near and outside a lower boundary of a region of the plasma. Deposition seeds from the target are ionized in the plasma region and accelerated vertically to be incident on the wafer and are deposited first on the bottoms of the grooves in a surface of the wafer. In burying deposition seeds in grooves and holes of high aspect ratios which are formed in the surface of the wafer, the deposition seeds can be deposited first on the bottoms without occurrence of voids.


Find Patent Forward Citations

Loading…