The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2000
Filed:
May. 22, 1997
Applicant:
Inventors:
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257782 ; 257783 ; 257669 ; 257674 ; 257676 ; 257643 ; 257785 ;
Abstract
A semiconductor device assembly having a support such as a lead frame paddle comprises a coating thereon to reduce or eliminate the flow of die attach adhesive from under the die and over bond sites or encapsulation regions. Thus undesirable effects resulting from this flow of adhesive, such as wire bonding problems and encapsulation problems, are reduced. A method for forming the assembly is also described.