The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2000

Filed:

Apr. 14, 1998
Applicant:
Inventors:

Juen-Kuen Lin, Kaohsiung, TW;

Chien-Hsin Lai, Kaohsiung Hsien, TW;

Peng-Yih Peng, Hsinchu Hsien, TW;

Hao-Kuang Chiu, Hsinchu, TW;

Kun-Lin Wu, Tai Chung, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B / ; B24B / ;
U.S. Cl.
CPC ...
451398 ; 451 41 ; 451397 ; 451288 ; 451286 ;
Abstract

A chemical-mechanical polishing machine having an improved wafer retainer ring design for the polishing head, comprising a polishing table, a polishing pad, a polishing head and a wafer retainer ring, wherein the polishing pad is above the polishing table, the polishing head is above the polishing pad, and the wafer retainer ring is mounted onto the polishing head. Improvement of the retainer ring design includes the formation of a plurality of guiding holes around the periphery of the retainer ring such that the guiding hole axis follows the centrifugal line produced by a rotating polishing head. Furthermore, the guiding hole has a gradual diffusing structure from the outer inlet to the inner outlet.


Find Patent Forward Citations

Loading…