The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 1999
Filed:
Mar. 19, 1998
Kun-Ching Chen, Tainan, TW;
Tao-Yu Chen, Kaohsiung, TW;
Yung-I Yeh, Kaohsiung, TW;
Wu-Chang Wang, Kaohsiung, TW;
Chun-Che Lee, Kaohsiung, TW;
Chun-Hsiung Huang, Kaohsiung Hsien, TW;
Shyh-Ing Wu, Kaohsiung Hsien, TW;
Abstract
A semiconductor packaging device includes a printed circuit board substrate, a mold gate formed on a periphery of the printed circuit board substrate through which a package encapsulant is poured to enclose electric elements mounted on a side of the printed circuit board, and a layer of non-metallic material covered on the side of the printed circuit board substrate in the mold gate area. The package encapsulant, after hardened, is bonded with the layer of non-metallic material, and the bonded package encapsulant/the layer of non-metallic material is degatable from the mold gate.