Method for manufacturing a tft sram memory device with improved

Abstract

A method of forming a contact between a conductor and a substrate region in a MOSFET SRAM starts with forming a dielectric layer on the surface of a partially completed SRAM device with pass and latch transistors covering the transistors. Then, form a thin film gate electrode and an interconnect on the dielectric layer with a gate oxide layer covering the gate electrode and the interconnect; cover the gate oxide layer with a poly conductive layer. Then form a silicon oxide layer over the poly conductive layer and pattern the silicon oxide layer to form a silicon oxide channel mask over the poly conductive layer which is used to pattern the silicon oxide layer into a channel mask over the gate electrode. The channel mask is used for patterning the implanting of dopant into the poly conductive layer aside from the channel mask to form a source region, a drain region and an interconnect in the poly conductive layer. Then form a contact through the gate oxide layer between the interconnect and the poly conductive layer by forming a tungsten layer over the poly conductive layer aside from the channel mask which remains in place.