The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 1999

Filed:

Feb. 15, 1996
Applicant:
Inventors:

Susan C Abraham, San Jose, CA (US);

Peter H Chen, Milpitas, CA (US);

Jerry Yang, Milpitas, CA (US);

Assignee:

LAM Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438714 ; 438720 ; 438738 ;
Abstract

A method, in a plasma processing chamber, for etching through a selected portion of layers of a wafer stack, which comprises an anti-reflective layer and a metallization layer disposed below the anti-reflective layer. The method comprises the step of etching at least partially through the anti-reflective layer of the wafer stack with a first chemistry that comprises both an etchant chemical and a polymer-forming chemical. Further, the method comprises the step of etching at least partially through the metallization layer of the wafer stack with a second chemistry different from the first chemistry.


Find Patent Forward Citations

Abraham, Susan. (1999). Methods for reducing etch rate loading while etching through a titanium (U.S. Patent No. 5952244). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5952244

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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