The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 1997
Filed:
Jul. 18, 1996
Applicant:
Inventors:
Rempei Nakata, Kamakura, JP;
Hisashi Kaneko, Fujisawa, JP;
Nobuo Hayasaka, Yokosuka, JP;
Takeshi Nishioka, Yokohama, JP;
Yoshikuni Tateyama, Hiratsuka, JP;
Yutaka Nakano, Yokkaichi, JP;
Yasutaka Sasaki, Natori, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
451 41 ; 451285 ; 451287 ; 451288 ; 451533 ; 451526 ;
Abstract
A polishing pad comprises at least a first layer having a first main surface serving to polish a substrate to be polished and a second main surface, and a second layer positioned to face the second main surface of the first layer and having fine bags arranged therein, fluid being hermetically sealed in the fine bag.
Quick Actions:
Nakata, Rempei. (1997). Polishing pad, polishing apparatus and polishing method (U.S. Patent No. 5664989). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5664989
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile