The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 1997

Filed:

Feb. 02, 1996
Applicant:
Inventors:

Tsu Shih, Chuwa, TW;

Chih-Chien Hung, Hsin-Chu, TW;

Yuan-Chang Huang, Hsin-Chu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438669 ; 438705 ; 438714 ; 438720 ; 438734 ;
Abstract

This invention provides a method for removing metal etch residue of silicon nodules, resulting from a small percentage of silicon in the metal, without causing overetch damage to the photoresist pattern, the metal electrode pattern, or to dielectric layers. The metal conductor layer is partially etched leaving from 20 to 80 percent of the original thickness. Any residue of silicon nodules formed during this partial etching is then removed using ion bombardment. The remainder of the metal conductor layer is then etched. A short overetch period is used to remove any remaining residue of silicon nodules. The overetch period is short and there is no deterioration of the photoresist or exposed edges of the electrode pattern.


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