Surface mountable integrated circuit package with low-profile detachable

Abstract

A molded integrated circuit package system of the type suitable for surface mounting is disclosed. The system includes a chip package having leads along its sides that are of the surface-mountable type, and having a plurality of connectors at its ends. A module is provided which contains components that are sensitive to solder temperatures or the chemicals used in the soldering process; examples of such components include batteries and quartz crystal resonators. The components may be disposed directly over the chip package or, in order to reduce the height of the package system, one or both of the components may be disposed outside of the outline of the chip package. The module has connectors extending therefrom that mate with the connectors on the chip package, such that the module may be removably connected to the chip package after the surface mounting of the chip package to a circuit board. Mechanical connection may be provided by snap members extending from the module which engage surfaces of the chip package when mounted thereto. Lockout tabs are provided on the chip package and the module to prevent improper mounting and electrical connection.