Irving, TX, United States of America

Tom Q Lao


Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 28(Granted Patents)


Company Filing History:


Years Active: 1995-1996

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3 patents (USPTO):Explore Patents

Title: The Innovations of Tom Q Lao

Introduction

Tom Q Lao is an accomplished inventor based in Irving, TX. He has made significant contributions to the field of integrated circuit packaging, holding a total of 3 patents. His work focuses on developing innovative solutions that enhance the functionality and efficiency of electronic components.

Latest Patents

One of Tom's latest patents is a surface mountable integrated circuit package with a low-profile detachable design. This molded integrated circuit package system is suitable for surface mounting and features leads along its sides that are of the surface-mountable type. The system includes a module containing components sensitive to solder temperatures or chemicals used in the soldering process, such as batteries and quartz crystal resonators. These components can be positioned directly over the chip package or outside its outline to reduce the height of the package system. The module connects to the chip package through connectors, allowing for a removable connection after surface mounting. Additionally, mechanical connections are facilitated by snap members, and lockout tabs are included to prevent improper mounting and electrical connection.

Career Highlights

Tom Q Lao has built a successful career at Sgs-thomson Microelectronics Limited, where he has been instrumental in advancing integrated circuit technology. His innovative designs have contributed to the development of more efficient electronic devices, showcasing his expertise in the field.

Collaborations

Throughout his career, Tom has collaborated with notable colleagues, including Harry Michael Siegel and Krishnan Kelappan. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Tom Q Lao's contributions to the field of integrated circuit packaging demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of electronic components and their applications, making him a valuable asset in the industry.

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