The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 1996
Filed:
Mar. 16, 1994
Kazuto Tsuji, Kawasaki, JP;
Yoshiyuki Yoneda, Kawasaki, JP;
Hideharu Sakoda, Kawasaki, JP;
Michio Sono, Kawasaki, JP;
Ichiro Yamaguchi, Kawasaki, JP;
Toshio Hamano, Kawasaki, JP;
Yoshihiro Kubota, Kawasaki, JP;
Michio Hayakawa, Kawasaki, JP;
Yoshihiko Ikemoto, Kawasaki, JP;
Yukio Saigo, Kagoshima, JP;
Naomi Miyaji, Kagoshima, JP;
Fujitsu Limited, Kawasaki, JP;
Kyushu Fujitsu Electronics Limited, Kagoshima, JP;
Abstract
A semiconductor device having a package in which a semiconductor device is sealed includes a base, and a metallic film is formed on a surface of the base. The semiconductor chip is formed on the metallic film. A pad formed on the semiconductor chip is connected to the metallic film by a wire. A sealing layer is formed on the metallic film. Leads are formed on the glass layer. A connecting layer is formed on the metallic film and contains electrically conductive particles. The connecting layer is in contact with a lead for a power supply system and connecting the metallic film to the lead.