The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 1994
Filed:
Sep. 17, 1992
Atsushi Hino, Osaka, JP;
Amane Mochizuki, Osaka, JP;
Kazuo Ouchi, Osaka, JP;
Shoji Morita, Osaka, JP;
Toshiki Naito, Osaka, JP;
Kazumi Higashi, Osaka, JP;
Masako Maeda, Osaka, JP;
Masayuki Kaneto, Osaka, JP;
Munekazu Tanaka, Osaka, JP;
Masakazu Sugimoto, Osaka, JP;
Nitto Denko Corporation, Tokyo, JP;
Abstract
A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed. The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer.