Company Filing History:
3 out of 3,870 
1 out of 172 
Years Active: 1985-1995
Title: Munekazu Tanaka: Innovator in Semiconductor Technology
Introduction
Munekazu Tanaka is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His innovative approaches have paved the way for advancements in flexible printed substrates and semiconductor device mounting methods.
Latest Patents
Tanaka's latest patents include a method of mounting a semiconductor device and a flexible printed substrate. The method of mounting a semiconductor device involves a film carrier with an insulating film that has a connecting lead and a semiconductor element. This method includes forming an opening for adhesive injection in the insulating film, allowing for effective bonding with an outer substrate. The flexible printed substrate is designed with adhesive properties for loading onto external substrates. It features a double printed substrate with metal layers or wiring circuits on both surfaces, along with a multilayer structure that enhances its functionality.
Career Highlights
Throughout his career, Munekazu Tanaka has worked with notable companies such as Nitto-Denko Corporation and Nitto Electric Industrial Co., Ltd. His experience in these organizations has contributed to his expertise in semiconductor technologies and materials.
Collaborations
Tanaka has collaborated with several professionals in his field, including Masakazu Sugimoto and Amane Mochizuki. These collaborations have fostered innovation and development in semiconductor applications.
Conclusion
Munekazu Tanaka's contributions to semiconductor technology and flexible printed substrates highlight his role as an influential inventor. His patents reflect a commitment to advancing technology in meaningful ways.